PCB CAD Design Specialist
Ville Saint-Laurent, Quebec, CA
EXFO develops smarter network test, monitoring, and analytics solutions for the world’s leading telecommunications service providers, network equipment manufacturers, and web-scale companies—and we love what we do!
With nearly 1,900 employees in more than 25 countries, EXFO is the world’s number one provider of fiber optic test solutions and has the largest active assurance deployment. Our broad portfolio of intelligent hardware and software solutions enables our customers’ network transformations related to fiber, 5G, virtualization, and big data analytics.
We are always looking for top talent to help us lead the way in a thriving industry with unlimited opportunities.
Job Summary
As a PCB CAD Specialist at EXFO, you will play a key role in designing printed circuit board (PCB) layouts and component placements used in our test and measurement products for the telecommunications industry. You will work closely with design and simulation engineers to define optimal routing strategies, via structures, and layer stackups that meet high-speed signal integrity requirements while ensuring manufacturability. You will then implement these strategies using Siemens/Mentor CAD tools.
Your work will directly contribute to the development of advanced PCB technologies delivering very high-speed performance (up to 448 Gbps).
Key Responsibilities
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Assist engineering teams in creating electronic components, symbols, and PCB footprints.
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Collaborate with engineers to analyze and propose routing strategies, via structures, and layer stackups optimized for high-speed signal performance.
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Work closely with the mechanical engineering team to define products that account for key mechanical considerations such as dimensional constraints, thermal management, and overall mechanical robustness.
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Collaborate with PCB manufacturing partners to review, understand, and challenge DFM (Design for Manufacturability) requirements.
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Work with simulation specialists to develop effective PCB design strategies that meet performance goals while considering DFM constraints.
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Prepare and deliver complete PCB design packages for fabrication and assembly.
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Coordinate with internal assembly and process specialists to ensure compliance with DFA (Design for Assembly) guidelines.
Technical Skills
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Strong knowledge of signal integrity in PCB design.
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Excellent understanding of power integrity for multi-power-source systems.
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Proficiency with PCB design tools (Siemens/Mentor Graphics).
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Experience with high-speed routing, ideally 28 Gbps and above (EXFO designs currently reach 106 Gbps / 212 Gbps).
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Knowledge of product lifecycle management tools and practices (BOM, ECO/ECR change management).
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Good understanding of DFM (Design for Manufacturability) and DFA (Design for Assembly) principles.
Profile
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Curious, detail-oriented, and passionate about high-speed PCB design.
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Motivated by achieving challenging design goals.
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Autonomous, organized, and capable of effectively managing priorities.
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Strong team player in a multidisciplinary environment.
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Bilingual (French and English).
Requirements
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College diploma in electronics or equivalent.
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8+ years of R&D experience, primarily in PCB design.
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Legal authorization to work in Canada.